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Metal Bond Grinding Wheels for Thinning Sapphire Polycrystalline Silicon Monocrystalline Silicon

Metal Bond Grinding Wheels for Thinning Sapphire Polycrystalline Silicon Monocrystalline Silicon

●Customized Accepted, Small Order Accepted
●Lead Time: 7 - 15 days
●Payment Terms: 30% T/T Deposit, 70% T/T Balance Before Shipment
●Country of Origin: China(mainland)
●Ex-Work Price, FOB Xiamen, or requested

Product Details

Metal Bond Diamond/CBN Grinding Wheels used for back side thinning and front side fine precision grinding of silicon wafer. Our grinding wheels are with superior performance and high cost performance, it can meet the top level requirement among the world. It can highly decrease the material loss of the sapphire, poly crystalline silicon and mono crystalline silicon, silicon ingots, etc.


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Welcome to wholesale the metal bond grinding wheels for thinning sapphire polycrystalline silicon monocrystalline silicon on sale from PRC. We are a professional supplier in China, offering the customized service. All of our products are made under strict quality control and management system. Please rest assured to buy.

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