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China Resin Bond Diamond Blades for Cutting Chip

China Resin Bond Diamond Blades for Cutting Chip

●Customized Accepted, Small Order Accepted
●Lead Time: 7 - 15 days
●Payment Terms: 30% T/T Deposit, 70% T/T Balance Before Shipment
●Country of Origin: China(mainland)
●Ex-Work Price, FOB Xiamen, or requested

Product Details

Resin Bond Diamond  Blades


Products Description


Resin bond diamond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.



Application 


Mainly used for cutting sapphire, single crystal silicon, quartz, semiconductor materials, chip, PCB, silicon carbide and carbon fiber



Advantages 


1. High-Precision, large depth and narrow kerf 

2. Smooth& fast cutting without chipping

3. Long life span and stable performance

4. Competitive price and superior quality

5. Safe package and fast delivery

6. Professional & excellent service


Item

Specification

OD

50-125mm

ID

25.4/40/88.9

Grit

200#-5000# (D107-D1)

Thickness

0.10-2.00mm (Based    on diamond grit size)

According to customers’ requirement             Email: allen@prctools.com 


Bond Agent:


※Resin bond & metal  bond & electroplated


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Welcome to wholesale the china resin bond diamond blades for cutting chip on sale from PRC. We are a professional supplier in China, offering the customized service. All of our products are made under strict quality control and management system. Please rest assured to buy.

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