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High Performance Metal Bond Ultra Thin Diamond Cutting Circular Blade for Sapphire and Monocrystalline Silicon

High Performance Metal Bond Ultra Thin Diamond Cutting Circular Blade for Sapphire and Monocrystalline Silicon

●Customized Accepted, Small Order Accepted
●Lead Time: 7 - 15 days
●Payment Terms: 30% T/T Deposit, 70% T/T Balance Before Shipment
●Country of Origin: China(mainland)
●Ex-Work Price, FOB Xiamen, or requested

Product Details

Metal Bond Diamond Blades

High Performance Metal Bond Ultra Thin Diamond Cutting Circular Blade for Sapphire and Monocrystalline Silicon


Products Description


Metal bond diamond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain. 

With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.



Application 


Mainly used for cutting sapphire, single crystal silicon, quartz, semiconductor materials, chip, PCB, silicon carbide and carbon fiber



Advantages 


1. High-Precision,large depth and narrow kerf 

2. Smooth&fast cutting without chipping

3. Long life span and stable performance

4. Competitive price and superior quality

5. Safe package and fast delivery

6. Professional & excellent service


Item

Specification

OD

50-125mm

ID

25.4/40/88.9

Grit

200#-5000# (D107-D1)

Thickness

0.10-2.00mm (Based    on diamond grit size)

According to customers’ requirement             Email: allen@prctools.com 


Bond Agent:


※Resin bond & metal  bond & electroplated


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Welcome to wholesale the high performance metal bond ultra thin diamond cutting circular blade for sapphire and monocrystalline silicon on sale from PRC. We are a professional supplier in China, offering the customized service. All of our products are made under strict quality control and management system. Please rest assured to buy.

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